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Inmax DDR Wafer
Memory Wafer：25 pcs / Lot -> 2 Device
DDR4 1G*8
DDR4 512M*16
DDR5/ HBM V2 Coming soon...
Memory Tester: Manufactured at a testing facility. Monthly wafer input capacity exceeds 2,000 wafers. The R&D team assists in developing test programs, ensuring only high-quality wafers proceed to chip packaging after testing and screening.
Outsourced packaging and testing: Multi-focus low-power laser stealth dicing machines ensure cutting quality. Packaged into DDR4 standard chips using advanced packaging equipment.
Inmax chip final products shipment.
| Features | DDR4 | DDR5 | DDR5 Advantages |
|---|---|---|---|
| Speed | 1.6 to 3.2 GT/s 0.8 to 1.6 GHz clock |
4.8 to 8.4 GT/s 1.6 to 4.2 GHz clock |
Higher bandwidth |
| IO Voltage | 1.2V | 1.1V | Lower power |
| Power Management | On motherboard | On DIMM PMIC | Better power efficiency Better scalability |
| Channel Architecture | 72-bit data channel (64 data + 8 ECC) 1 channel per DIMM |
40-bit data channel (32 data + 8 ECC) 2 channels per DIMM |
Higher memory efficiency Lower latency |
| Burst Length | BC4, BL8 | BC8, BL16 | Higher memory efficiency |
| Max. Die Density | 16Gb | 64Gb | Higher capacity DIMMS |
| More Intelligence | SPD (I²C) | SPD Hub & Temperature Sensors (I²C) | Enhanced system management Greater telemetry for thermal management |