Loading...
Memory Wafer：25 pcs / Lot >>
2 Device
DDR4 1G*8
DDR4 512M*16
DDR5/ HBM V2 Coming soon
Memory 測試機：在測試廠生產
投片月產能 2000 片晶圓以上
RD team 協助開發測試程式，測試通過才能進行下一製程
外包 IC 封測廠：多焦點低功率雷射隱形切割機保證切割品質
封裝廠 DDR4 標準顆粒：先進封裝設備
駿吉科技成品出貨
| Features | DDR4 | DDR5 | DDR5 Advantages |
|---|---|---|---|
| Speed | 1.6 to 3.2 GT/s 0.8 to 1.6 GHz clock | 4.8 to 8.4 GT/s 1.6 to 4.2 GHz clock | Higher bandwidth |
| IO Voltage | 1.2V | 1.1V | Lower power |
| Power Management | On motherboard | On DIMM PMIC | Better power efficiency Better scalability |
| Channel Architecture | 72-bit data channel (64 data + 8 ECC) 1 channel per DIMM | 40-bit data channel (32 data + 8 ECC) 2 channels per DIMM | Higher memory efficiency Lower latency |
| Burst Length | BC4, BL8 | BC8, BL16 | Higher memory efficiency |
| Max. Die Density | 16Gb | 64Gb | Higher capacity DIMMS |
| More Intelligence | SPD (IZC) | SPD Hub & Temperature Sensors (I"C) | Enhanced system management Greater telemetry for thermal management |