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| Mdel Name | IM LG3001 | IM LG3002 | IM LS3001 | IM LS3002 | IM LS2002 | ||
|---|---|---|---|---|---|---|---|
| Processing Method | Units | SI Grooving | SI Grooving | SI Stealth | Glass Stealth | SIC Stealth | |
| Laser Source | Wave Length | nm | 532mm | 532mm | 1135mm | 532mm | 1064mm |
| Power | w | 60W | 60W | 8W | 20W | 18W | |
| PS | PICO | PICO | PICO | PICO | PICO | ||
| Shaping Method | SLM | SLM/DOE | SLM | SLM | SLM | ||
| Wafer Size | inch | 6", 8", 12" | 6", 8", 12" | 6", 8", 12" | 6", 8", 12" | 6", 8" | |
| X-axis | Processing range | mm | 500 | 500 | 500 | 500 | 300 |
| Moving speed | mm/s | 50~1000 | 50~1000 | 50~1000 | 50~1000 | 50~1000 | |
| Linearity | um | ±0.5 | ±0.5 | ±0.5 | ±0.5 | ±1 | |
| Repeatability Accuracy | um | ±0.2 | ±0.2 | ±0.2 | ±0.2 | ±0.5 | |
| Y-axis | Processing range | mm | 450 | 450 | 450 | 450 | 300 |
| Linearity | um | ±1 | ±1 | ±0.5 | ±0.5 | ±1 | |
| Repeatability Accuracy | um | ±0.5 | ±0.5 | ±0.2 | ±0.2 | ±0.5 | |
| Optical Axis | Moving resolution | mm | 0.00005 | 0.00005 | 0.00005 | 0.00005 | 0.00005 |
| Repeatability accuracy | mm | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 | |
| θ-axis (Chuck table) | deg | 120 | 120 | 120 | 120 | 120 | |
| Power consumption | kW | 11 | 11 | 6 | 5.5 | 6 | |
| Compressed air | kg | 6.5 | 6.5 | 6.5 | 6.5 | 6.5 | |
| Air consumption | L/mins | 3000 | 3000 | 2000 | 2000 | 2000 | |
| Weight | T | 4.4~4.6 | 4.4~4.6 | 3.2~3.6 | 3.2~3.6 | 3.1~3.5 | |